南開科技大學圖書館 |

Language: 繁體中文

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Electronic assembly fabrication :chips, circuit boards, packages, and components /

紀錄類型:	書目-語言資料,印刷品 : 單行本
正題名/作者:	Electronic assembly fabrication :/ Charles A. Harper, editor-in-chief.
其他題名:	chips, circuit boards, packages, and components /
其他作者:	Harper, Charles A.
出版者:	New York :McGraw-Hill,c2002.
面頁冊數:	xv, 672 p. :ill. ;24 cm.
叢書名:	McGraw-Hill professional engineering
標題:	Electronic apparatus and appliances - Design and construction. -
ISBN:	0071378820 (hbk.) :

Electronic assembly fabrication :chips, circuit boards, packages, and components /
Electronic assembly fabrication :chips, circuit boards, packages, and components /Charles A. Harper, editor-in-chief. - 1st ed. - New York :McGraw-Hill,c2002. - xv, 672 p. :ill. ;24 cm. - McGraw-Hill professional engineering.

ISBN: 0071378820 (hbk.) :NT1587

LCCN: 2002022737Subjects--Topical Terms:

150127
Electronic apparatus and appliances
--Design and construction.

LC Class. No.: TK7870 / .E4424 2002

Dewey Class. No.: 621.381

Electronic assembly fabrication :chips, circuit boards, packages, and components /
LDR:00724nam _2200217 a_450 001 132446
005 19991009090853.0
008 021023s2002 nyua b 001 0 eng d
010 $a 2002022737
020 $a 0071378820 (hbk.) : $c NT1587
035 $a 00061550
040 $a DLC $c DLC $d DLC
042 $a pcc
050 0 0 $a TK7870 $b .E4424 2002
082 0 0 $a 621.381 $2 21
092 $a */621.381/E37/2002////095575
245 0 0 $a Electronic assembly fabrication : $b chips, circuit boards, packages, and components / $c Charles A. Harper, editor-in-chief.
250 $a 1st ed.
260 $a New York : $b McGraw-Hill, $c c2002.
300 $a xv, 672 p. : $b ill. ; $c 24 cm.
440 0 $a McGraw-Hill professional engineering
440 0 $a Electronic packaging and interconnection series
650 0 $a Electronic apparatus and appliances $x Design and construction. $3 150127
700 1 $a Harper, Charles A. $3 149455