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Demystifying chipmaking

紀錄類型:	書目-電子資源 : 單行本
正題名/作者:	Demystifying chipmaking/ by Richard F. Yanda, Michael Heynes and Anne K. Miller.
作者:	Yanda, Richard F.
其他作者:	Heynes, Michael.
出版者:	Oxford :Newnes ;2005.
面頁冊數:	xvii, 256 p. :ill. ;24 cm.
標題:	Logic circuits - Design and construction. -
電子資源:	An electronic book accessible through the World Wide Web; click for information
電子資源:	An electronic book accessible through the World Wide Web; click for information
電子資源:	http://www.loc.gov/catdir/enhancements/fy0626/2005277383-d.html
電子資源:	http://www.loc.gov/catdir/enhancements/fy0626/2005277383-t.html
ISBN:	9780080477091 (electronic bk.)
ISBN:	0080477097 (electronic bk.)
ISBN:	9780750677608 (paper)
ISBN:	0750677600 (paper)

Demystifying chipmaking
Yanda, Richard F.

Demystifying chipmaking[electronic resource] /by Richard F. Yanda, Michael Heynes and Anne K. Miller. - Oxford :Newnes ;2005. - xvii, 256 p. :ill. ;24 cm.

Includes bibliographical references and index.

CH 1: IC Fabrication Overview / CH 2: Support Technologies / CH 3: Forming Wells / CH 4: Isolate Active Areas (Shallow Trench Isolation) / CH 5: Building the Transistors / CH 6: First Level Metallization / CH 7: Multilevel Metal Interconnects and Dual Damascene / CH 8: Test and Assembly / APPENDIX A: Science Overview / APPENDIX B: Plasma Etch Supplement to Chapter 4.

This book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley. The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included. "The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design." * Included CD gives the reader a much greater comprehension of the process than a strictly print book with static illustrations provides * Authors are actual engineers who have a broad range of exposure and experience with chip technology * Contains a unique chapter describing the nature of the semiconductor industry from a business perspective.

Includes CD-ROM.

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2007.

Mode of access: World Wide Web.

ISBN: 9780080477091 (electronic bk.)

Source: 104115:104136Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

159363
Logic circuits
--Design and construction.Index Terms--Genre/Form:

172687
Electronic books.

LC Class. No.: TK7868.L6 / Y34 2004eb

Dewey Class. No.: 621.39732

Demystifying chipmaking
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020 $a 0080477097 (electronic bk.)
020 $a 9780750677608 (paper)
020 $a 0750677600 (paper)
035 $a (OCoLC)162593024
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037 $a 104115:104136 $b Elsevier Science & Technology $n http://www.sciencedirect.com
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050 1 4 $a TK7868.L6 $b Y34 2004eb
082 0 4 $a 621.39732 $2 22{me_controlnum}
100 1 $a Yanda, Richard F. $3 1000060341
245 1 0 $a Demystifying chipmaking $h [electronic resource] / $c by Richard F. Yanda, Michael Heynes and Anne K. Miller.
260 $a Oxford : $b Newnes ; $a Amsterdam : $b Elsevier, $c 2005.
300 $a xvii, 256 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
505 0 $a CH 1: IC Fabrication Overview / CH 2: Support Technologies / CH 3: Forming Wells / CH 4: Isolate Active Areas (Shallow Trench Isolation) / CH 5: Building the Transistors / CH 6: First Level Metallization / CH 7: Multilevel Metal Interconnects and Dual Damascene / CH 8: Test and Assembly / APPENDIX A: Science Overview / APPENDIX B: Plasma Etch Supplement to Chapter 4.
505 0 $a IC fabrication overview -- Introduction -- Support technologies -- Integrated circuit fabrication -- Test and assembly -- Summary -- Support technologies -- Introduction -- Contamination control -- Crystal growth and wafer preparation -- Circuit design -- Photomask and reticle preparation -- Forming wells -- Introduction -- Initial oxidation -- Photolithography -- Ion implantation -- Isolate active areas (shallow trench isolation) -- Introduction to shallow trench isolation -- Pad oxide growth -- Silicon Nitride deposition -- Photolithography for photo/etch -- From trenches in silicon dioxide -- Chemical mechanical polishing (CMP) to remove excess dioxide -- Wet etch removal of Silicon Nitride and pad oxide -- Building the transistors -- Introduction -- Thin film formation -- Poly gate formation -- Source/drain formation -- Salicide formation -- First level metallization -- Introduction -- Nitride and oxide depositions -- CMP planarization -- Photo/etch for contact holes -- Tungsten plug process -- Low-k dielectric process -- Copper first level interconnection process -- Multilevel metal interconnects and dual damascene -- Introduction -- Deposit barrier layer and intermetal dielectric -- Dual damascene process -- Form bonding pads -- Final passivation process -- Test and assembly -- Introduction -- Wafer and chip testing -- Assembly and packaging.
520 $a This book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley. The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included. "The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design." * Included CD gives the reader a much greater comprehension of the process than a strictly print book with static illustrations provides * Authors are actual engineers who have a broad range of exposure and experience with chip technology * Contains a unique chapter describing the nature of the semiconductor industry from a business perspective.
525 $a Includes CD-ROM.
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2007. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Aug. 2, 2007). $n Access may be restricted to users at subscribing institutions.
650 0 $a Logic circuits $x Design and construction. $3 159363
650 0 $a Metal oxide semiconductors, Complementary. $3 148269
655 7 $a Electronic books. $2 local. $3 172687
700 1 $a Heynes, Michael. $3 1000060342
700 1 $a Miller, Anne K. $3 1000060343
710 2 $a ScienceDirect (Online service) $3 1000060142
776 1 $c Original $z 0750677600 $z 9780750677608 $w (DLC) 2005277383 $w (OCoLC)61130893
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780750677608 $z An electronic book accessible through the World Wide Web; click for information
856 4 0 $3 Referex $u http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780750677608 $z An electronic book accessible through the World Wide Web; click for information
856 4 2 $3 Publisher description $u http://www.loc.gov/catdir/enhancements/fy0626/2005277383-d.html
856 4 1 $3 Table of contents $u http://www.loc.gov/catdir/enhancements/fy0626/2005277383-t.html