南開科技大學圖書館 |

回首頁

Tribology of abrasive machining processes

紀錄類型:	書目-電子資源 : 單行本
正題名/作者:	Tribology of abrasive machining processes/ Ioan D. Marinescu ... [et al.].
其他作者:	Marinescu, Ioan D.
出版者:	Norwich, NY :William Andrew Pub.,c2004.
面頁冊數:	xxvii, 724 p. :ill. ;24 cm.
標題:	Grinding and polishing. -
電子資源:	An electronic book accessible through the World Wide Web; click for information
ISBN:	9780815514909 (paper)
ISBN:	0815514905 (paper)

Tribology of abrasive machining processes
Tribology of abrasive machining processes[electronic resource] /Ioan D. Marinescu ... [et al.]. - Norwich, NY :William Andrew Pub.,c2004. - xxvii, 724 p. :ill. ;24 cm.

Includes bibliographical references and index.

Introduction to Abrasive Processes -- Tribosystems of Abrasive Machining Processes -- Kinematic Models of Abrasive Contacts -- Contact Mechanics -- Forces, Friction, and Energy -- Thermal Design of Processes -- Molecular Dynamics for Abrasive Process Simulation -- Fluid Delivery -- Electrolytic In-Process Dressing (ELID) Grinding and Polishing -- Grinding Wheel and Abrasive Topography -- Abrasives and Abrasive Tools -- Conditioning of Abrasive Wheels -- Loose Abrasive Processes -- Process Fluids for Abrasive Machining -- Tribology of Abrasive Machining -- Processed Materials.

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2008.

Mode of access: World Wide Web.

ISBN: 9780815514909 (paper)Subjects--Topical Terms:

152364
Grinding and polishing.
Index Terms--Genre/Form:

172687
Electronic books.

LC Class. No.: TJ1280 / .T68 2004eb

Dewey Class. No.: 621.8/9

Tribology of abrasive machining processes
LDR:02605cmm 22002654a 4500 001 1000046030
003 OCoLC
005 20100518081709.0
006 m d
007 cr cn
008 081212s2004 nyua sb 001 0 eng d
020 $a 9780815514909 (paper)
020 $a 0815514905 (paper)
035 $a (OCoLC)281606798
035 $a ocn281606798
040 $a OPELS $b eng $c OPELS $d OPELS
050 1 4 $a TJ1280 $b .T68 2004eb
082 0 4 $a 621.8/9 $2 22{me_controlnum}
245 0 0 $a Tribology of abrasive machining processes $h [electronic resource] / $c Ioan D. Marinescu ... [et al.].
260 $a Norwich, NY : $b William Andrew Pub., $c c2004.
300 $a xxvii, 724 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
505 0 $a Introduction to Abrasive Processes -- Tribosystems of Abrasive Machining Processes -- Kinematic Models of Abrasive Contacts -- Contact Mechanics -- Forces, Friction, and Energy -- Thermal Design of Processes -- Molecular Dynamics for Abrasive Process Simulation -- Fluid Delivery -- Electrolytic In-Process Dressing (ELID) Grinding and Polishing -- Grinding Wheel and Abrasive Topography -- Abrasives and Abrasive Tools -- Conditioning of Abrasive Wheels -- Loose Abrasive Processes -- Process Fluids for Abrasive Machining -- Tribology of Abrasive Machining -- Processed Materials.
520 $a Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2008. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Dec. 9, 2008). $n Access may be restricted to users at subscribing institutions.
650 0 $a Grinding and polishing. $3 152364
650 0 $a Tribology. $3 165230
655 7 $a Electronic books. $2 local. $3 172687
700 1 $a Marinescu, Ioan D. $3 1000060653
710 2 $a ScienceDirect (Online service) $3 1000060142
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780815514909 $z An electronic book accessible through the World Wide Web; click for information