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Chip scale package, CSP :design, mat...

~

Lau, John H.

Chip scale package, CSP :design, materials, processes, and applications /

紀錄類型:	書目-語言資料,印刷品 : 單行本
正題名/作者:	Chip scale package, CSP :/ John H. Lau, Shi-Wei Ricky Lee.
其他題名:	design, materials, processes, and applications /
作者:	Lau, John H.
其他作者:	Lee, Shi-Wei Ricky.
出版者:	New York :McGraw-Hill,c1999.
面頁冊數:	xxii, 564 p. :ill. ;24 cm.
附註:	Includes index.
叢書名:	Electronic packaging and interconnection series
標題:	Integrated circuits - Design and construction. -
ISBN:	0071165088 (hbk) :

Chip scale package, CSP :design, materials, processes, and applications /
Lau, John H.

Chip scale package, CSP :design, materials, processes, and applications /John H. Lau, Shi-Wei Ricky Lee. - New York :McGraw-Hill,c1999. - xxii, 564 p. :ill. ;24 cm. - Electronic packaging and interconnection series.

Includes index.

ISBN: 0071165088 (hbk) :NT729

LCCN: 98053224 Subjects--Topical Terms:

148752
Integrated circuits
--Design and construction.

LC Class. No.: TK7874 / .L3167 1999

Dewey Class. No.: 621.3815

Chip scale package, CSP :design, materials, processes, and applications /
LDR:00666nam _2200205 a_450 001 132962
005 20020928162330.0
008 021021s1999 nyua b 001 0 eng d
010 $a 98053224
020 $a 0071165088 (hbk) : $c NT729
035 $a 00062069
040 $a DLC $c DLC
042 $a pcc
050 0 0 $a TK7874 $b .L3167 1999
082 0 0 $a 621.3815 $2 21
092 $a */621.3815/L366-2/1999////095341
100 1 $a Lau, John H. $3 147060
245 1 0 $a Chip scale package, CSP : $b design, materials, processes, and applications / $c John H. Lau, Shi-Wei Ricky Lee.
260 $a New York : $b McGraw-Hill, $c c1999.
300 $a xxii, 564 p. : $b ill. ; $c 24 cm.
440 0 $a Electronic packaging and interconnection series
500 $a Includes index.
650 0 $a Integrated circuits $x Design and construction. $3 148752
650 0 $a Microelectronic packaging. $3 147065
700 1 $a Lee, Shi-Wei Ricky. $3 151304

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