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Three-Dimensional Integration and Mo...
~
Lee, Jong-Hoon.
Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /
紀錄類型:
書目-電子資源 : 單行本
正題名/作者:
Three-Dimensional Integration and Modeling/ by Jong-Hoon Lee, Manos M. Tentzeris.
其他題名:
A Revolution in RF and Wireless Packaging /
作者:
Lee, Jong-Hoon.
其他作者:
Tentzeris, Manos M.
面頁冊數:
X, 108 p.online resource.
Contained By:
Springer Nature eBook
標題:
Engineering. -
電子資源:
Fulltext (查閱電子書全文)
ISBN:
9783031017032
Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /
Lee, Jong-Hoon.
Three-Dimensional Integration and Modeling
A Revolution in RF and Wireless Packaging /[electronic resource] :by Jong-Hoon Lee, Manos M. Tentzeris. - 1st ed. 2008. - X, 108 p.online resource. - Synthesis Lectures on Computational Electromagnetics,1932-1716. - Synthesis Lectures on Computational Electromagnetics,.
Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
ISBN: 9783031017032
Standard No.: 10.1007/978-3-031-01703-2doiSubjects--Topical Terms:
162510
Engineering.
LC Class. No.: T1-995
Dewey Class. No.: 620
Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /
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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
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