Languages
蕭傳議
Overview
| Works: | 2 works in 2 publications in 1 languages | |
|---|---|---|
Titles
先進封裝的關鍵零組件IC載板 = The key component of IC package-IC substrate
by:
董鍾明; 蕭傳議; 駱韋仲
(Language materials, printed)
, [作]
由下游資通訊產品看電路板及其原物料市場趨勢 = PCB & its raw materials market trends judging from the information and communication products in the downstream
by:
李祺菁; 蕭傳議
(Language materials, printed)
, [作]