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Practical Guide to the Packaging of Electronics :Thermal and Mechanical Design and Analysis.

紀錄類型:	書目-電子資源 : 單行本
正題名/作者:	Practical Guide to the Packaging of Electronics :/
其他題名:	Thermal and Mechanical Design and Analysis.
作者:	Jamnia, Ali.
出版者:	Hoboken :Taylor & Francis Ltd,2008.
面頁冊數:	336 p.
標題:	Electronic packaging. -
電子資源:	Click here for online access to this book (查閱全文)
ISBN:	9781420065312 (electronic bk.)
ISBN:	1420065408 (electronic bk.)

Practical Guide to the Packaging of Electronics :Thermal and Mechanical Design and Analysis.
Jamnia, Ali.

Practical Guide to the Packaging of Electronics :Thermal and Mechanical Design and Analysis.[electronic resource]. - 2nd ed. - Hoboken :Taylor & Francis Ltd,2008. - 336 p. - Dekker Mechanical Engineering, v. 146. - Dekker Mechanical Engineering, v. 146..

Presents a basic understanding of the issues that concern the field of electronics packaging. This work discusses topics including various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; and, mechanical, electrical and chemically induced reliability.

Electronic reproduction.

Available via World Wide Web.

Mode of access: World Wide Web.

ISBN: 9781420065312 (electronic bk.)Subjects--Topical Terms:

148362
Electronic packaging.
Index Terms--Genre/Form:

172687
Electronic books.

LC Class. No.: TK7870.15.J36 2009

Dewey Class. No.: 621.381046

Practical Guide to the Packaging of Electronics :Thermal and Mechanical Design and Analysis.
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