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Three-Dimensional Integration and Mo...

Lee, Jong-Hoon.

Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /

紀錄類型:	書目-電子資源 : 單行本
正題名/作者:	Three-Dimensional Integration and Modeling/ by Jong-Hoon Lee, Manos M. Tentzeris.
其他題名:	A Revolution in RF and Wireless Packaging /
作者:	Lee, Jong-Hoon.
其他作者:	Tentzeris, Manos M.
面頁冊數:	X, 108 p.online resource.
Contained By:	Springer Nature eBook
標題:	Engineering. -
電子資源:	Fulltext (查閱電子書全文)
ISBN:	9783031017032

Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /
Lee, Jong-Hoon.

Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /[electronic resource] :by Jong-Hoon Lee, Manos M. Tentzeris. - 1st ed. 2008. - X, 108 p.online resource. - Synthesis Lectures on Computational Electromagnetics,1932-1716. - Synthesis Lectures on Computational Electromagnetics,.

Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.

ISBN: 9783031017032

Standard No.: 10.1007/978-3-031-01703-2doiSubjects--Topical Terms:

162510
Engineering.

LC Class. No.: T1-995

Dewey Class. No.: 620

Three-Dimensional Integration and ModelingA Revolution in RF and Wireless Packaging /
LDR:02621nmm a22003735i 4500 001 1000127430
003 DE-He213
005 20230111192915.0
007 cr nn 008mamaa
008 220601s2008 sz | s |||| 0|eng d
020 $a 9783031017032 $9 978-3-031-01703-2
024 7 $a 10.1007/978-3-031-01703-2 $2 doi
035 $a 978-3-031-01703-2
050 4 $a T1-995
072 7 $a TBC $2 bicssc
072 7 $a TEC000000 $2 bisacsh
072 7 $a TBC $2 thema
082 0 4 $a 620 $2 23
100 1 $a Lee, Jong-Hoon. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1000149481
245 1 0 $a Three-Dimensional Integration and Modeling $h [electronic resource] : $b A Revolution in RF and Wireless Packaging / $c by Jong-Hoon Lee, Manos M. Tentzeris.
250 $a 1st ed. 2008.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2008.
300 $a X, 108 p. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
490 1 $a Synthesis Lectures on Computational Electromagnetics, $x 1932-1716
505 0 $a Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
520 $a This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
650 0 $a Engineering. $3 162510
650 0 $a Electrical engineering. $3 191626
650 0 $a Telecommunication. $3 151349
650 1 4 $a Technology and Engineering. $3 1000149430
650 2 4 $a Electrical and Electronic Engineering. $3 1000149431
650 2 4 $a Microwaves, RF Engineering and Optical Communications. $3 1000149432
700 1 $a Tentzeris, Manos M. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1000149464
710 2 $a SpringerLink (Online service) $3 1000143549
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783031005756
776 0 8 $i Printed edition: $z 9783031028311
830 0 $a Synthesis Lectures on Computational Electromagnetics, $x 1932-1716 $3 1000149465
856 4 0 $u https://doi.org/10.1007/978-3-031-01703-2 $z Fulltext (查閱電子書全文)
912 $a ZDB-2-SXSC
950 $a Synthesis Collection of Technology (R0) (SpringerNature-85007)

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