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Flip chip technologies /

~

Lau, John H.

Flip chip technologies /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Flip chip technologies // John H. Lau, editor.
other author:	Lau, John H.
Published:	New York :McGraw-Hill,c1996.
Description:	xxiv, 565 p. :ill. ;24 cm.
Series:	Electronic packaging and interconnection series
Subject:	Integrated circuits - Very large scale integration -
ISBN:	0070366098

Flip chip technologies /
Flip chip technologies /John H. Lau, editor. - New York :McGraw-Hill,c1996. - xxiv, 565 p. :ill. ;24 cm. - Electronic packaging and interconnection series.

Includes bibliographical references and index.

ISBN: 0070366098

LCCN: 95044649 Subjects--Topical Terms:

146864
Integrated circuits
--Very large scale integration

LC Class. No.: TK7874 / .F5897 1996

Dewey Class. No.: 621.381/046

Flip chip technologies /
LDR:00624nam _2200205 a_450 001 131385
003 DLC
005 19990721133120.0
008 950929s1996 nyua b 001 0 eng
010 $a 95044649
020 $a 0070366098
035 $a 00054028
040 $a DLC $c DLC $d DLC
050 0 0 $a TK7874 $b .F5897 1996
082 0 0 $a 621.381/046 $2 20
092 $a */621.381046/F626/1996////086746
245 0 0 $a Flip chip technologies / $c John H. Lau, editor.
260 $a New York : $b McGraw-Hill, $c c1996.
300 $a xxiv, 565 p. : $b ill. ; $c 24 cm.
440 0 $a Electronic packaging and interconnection series
504 $a Includes bibliographical references and index.
650 0 $a Integrated circuits $x Very large scale integration $x Design and construction. $3 146864
650 0 $a Microelectronic packaging. $3 147065
650 0 $a Multichip modules (Microelectronics) $x Design and construction. $3 147066
700 1 $a Lau, John H. $3 147060

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086746

六樓西文書庫 (6th Floor-Western Books)

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* 621.381046 F626 1996

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5030400-0880004

1 records • Pages 1 •
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