Languages
董鍾明
Overview
| Works: | 5 works in 5 publications in 1 languages | |
|---|---|---|
Titles
先進封裝的關鍵零組件IC載板 = The key component of IC package-IC substrate
by:
董鍾明; 蕭傳議; 駱韋仲
(Language materials, printed)
, [作]
從IC設計業看EDA產業發展之歷程與前景 = The prospect & developmant trend of electronic design automation industry from IC design industry's point of view
by:
董鍾明
(Language materials, printed)
, [作]
SoC趨勢下的封測技術變革與廠商發展策略 = Changes in package & test technologies & development strategies under SOC
by:
董鍾明
(Language materials, printed)
, [作]