郭文傑

兩岸構裝材料產業發展機會探討 = Exploration into development opportunities of cross : IC構裝; strait IC package material market by: 張惠郁; 洪德芳; 郭文傑 (Language materials, printed) , [作]

兩岸電子材料市場及技術競合分析 = Trade-off analysis of electronic material market and technology in crossing-strait by: 郭文傑 (Language materials, printed) , [作]