郭文傑

兩岸構裝材料產業發展機會探討 = Exploration into development opportunities of cross : IC構裝; strait IC package material market …で: 張惠郁; 洪德芳; 郭文傑 (言語・文字資料 (印刷物)) , [作]

兩岸電子材料市場及技術競合分析 = Trade-off analysis of electronic material market and technology in crossing-strait by: 郭文傑 (書目-語言資料,印刷品) , [作]