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Solder joint reliability of BGA, CSP...
~
Lau, John H.
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies // John H. Lau, Yi-hsin Pao.
作者:
Lau, John H.
其他作者:
Pao, Yi-hsin.
出版者:
New York :McGraw-Hill,c1997.
面頁冊數:
xxi, 408 p. :ill. ;24 cm.
叢書名:
Electronic packaging and interconnection series
標題:
Microelectronic packaging - Reliability. -
ISBN:
0070366489 (hc : acid-free paper)
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
Lau, John H.
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
John H. Lau, Yi-hsin Pao. - New York :McGraw-Hill,c1997. - xxi, 408 p. :ill. ;24 cm. - Electronic packaging and interconnection series.
Includes bibliographical references and index.
ISBN: 0070366489 (hc : acid-free paper)
LCCN: 96031361 Subjects--Topical Terms:
147062
Microelectronic packaging
--Reliability.
LC Class. No.: TK7874 / .L317 1997
Dewey Class. No.: 621.381/046
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
LDR
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*/621.381046/L366/1997////086745
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Lau, John H.
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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
$c
John H. Lau, Yi-hsin Pao.
260
$a
New York :
$b
McGraw-Hill,
$c
c1997.
300
$a
xxi, 408 p. :
$b
ill. ;
$c
24 cm.
440
0
$a
Electronic packaging and interconnection series
504
$a
Includes bibliographical references and index.
650
0
$a
Microelectronic packaging
$x
Reliability.
$3
147062
650
0
$a
Solder and soldering
$x
Testing.
$3
147063
650
0
$a
Multichip modules (Microelectronics)
$x
Testing.
$3
147064
700
1
$a
Pao, Yi-hsin.
$3
147061
0 筆讀者評論
館藏地:
ALL
六樓西文書庫 (6th Floor-Western Books)
出版年:
卷號:
館藏
1 筆 • 頁數 1 •
1
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索書號
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預約人數
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附件
086745
六樓西文書庫 (6th Floor-Western Books)
一般借閱
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* 621.381046 L366 1997
一般(Normal)
在架
0
5030400-0880004
1 筆 • 頁數 1 •
1
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