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Solder joint reliability of BGA, CSP...

Lau, John H.

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /

紀錄類型:	書目-語言資料,印刷品 : 單行本
正題名/作者:	Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies // John H. Lau, Yi-hsin Pao.
作者:	Lau, John H.
其他作者:	Pao, Yi-hsin.
出版者:	New York :McGraw-Hill,c1997.
面頁冊數:	xxi, 408 p. :ill. ;24 cm.
叢書名:	Electronic packaging and interconnection series
標題:	Microelectronic packaging - Reliability. -
ISBN:	0070366489 (hc : acid-free paper)

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
Lau, John H.

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /John H. Lau, Yi-hsin Pao. - New York :McGraw-Hill,c1997. - xxi, 408 p. :ill. ;24 cm. - Electronic packaging and interconnection series.

Includes bibliographical references and index.

ISBN: 0070366489 (hc : acid-free paper)

LCCN: 96031361 Subjects--Topical Terms:

147062
Microelectronic packaging
--Reliability.

LC Class. No.: TK7874 / .L317 1997

Dewey Class. No.: 621.381/046

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
LDR:00707nam _2200205 a_450 001 131384
003 DLC
005 19990721133102.0
008 960628s1997 nyua b 001 0 eng
010 $a 96031361
020 $a 0070366489 (hc : acid-free paper)
035 $a 00054027
040 $a DLC $c DLC $d DLC
050 0 0 $a TK7874 $b .L317 1997
082 0 0 $a 621.381/046 $2 20
092 $a */621.381046/L366/1997////086745
100 1 $a Lau, John H. $3 147060
245 1 0 $a Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / $c John H. Lau, Yi-hsin Pao.
260 $a New York : $b McGraw-Hill, $c c1997.
300 $a xxi, 408 p. : $b ill. ; $c 24 cm.
440 0 $a Electronic packaging and interconnection series
504 $a Includes bibliographical references and index.
650 0 $a Microelectronic packaging $x Reliability. $3 147062
650 0 $a Solder and soldering $x Testing. $3 147063
650 0 $a Multichip modules (Microelectronics) $x Testing. $3 147064
700 1 $a Pao, Yi-hsin. $3 147061

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