Languages
Lau, John H.
Overview
| Works: | 1 works in 6 publications in 1 languages | |
|---|---|---|
Titles
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
by:
Lau, John H.
(Language materials, printed)
Chip scale package, CSP :design, materials, processes, and applications /
by:
Lau, John H.; Lee, Shi-Wei Ricky.
(Language materials, printed)
Electronic packaging :design, materials, process, and reliability /
by:
Lau, John H.
(Language materials, printed)
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
by:
Lau, John H.; Pao, Yi-hsin.
(Language materials, printed)
Subjects
Integrated circuits- Very large scale integration
Ball grid array technology.
Multichip modules (Microelectronics)- Design and construction.
Integrated circuits- Design and construction.
Microelectronic packaging- Reliability.
Multichip modules (Microelectronics)- Testing.
Electronic packaging.
Microelectronic packaging.
Solder and soldering- Testing.