語系
Lau, John H.
概観
| 著作: | 1 作品に 6 出版物中に 1 言語 | |
|---|---|---|
タイトル
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
…で:
Lau, John H.
(言語・文字資料 (印刷物))
Chip scale package, CSP :design, materials, processes, and applications /
…で:
Lau, John H.; Lee, Shi-Wei Ricky.
(言語・文字資料 (印刷物))
Electronic packaging :design, materials, process, and reliability /
…で:
Lau, John H.
(言語・文字資料 (印刷物))
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
…で:
Lau, John H.; Pao, Yi-hsin.
(言語・文字資料 (印刷物))
主題
Integrated circuits- Very large scale integration
Ball grid array technology.
Multichip modules (Microelectronics)- Design and construction.
Integrated circuits- Design and construction.
Microelectronic packaging- Reliability.
Multichip modules (Microelectronics)- Testing.
Electronic packaging.
Microelectronic packaging.
Solder and soldering- Testing.